Exhibition | EAI Technology Shines at the Optoelectronics Expo, Sharing the Stage with Global Cutting-Edge Optoelectronic Technologies

On September 6, the industry event covering the entire optoelectronic industry chain - the 24th China International Optoelectronic Exposition (CIOE) kicked off in Shenzhen. The exhibition area of this event reached a historic high, covering the entire optoelectronic industry chain including information communication, optics, lasers, sensors, displays, etc. Shenzhen EAI Technology Co., Ltd. (EAI Technology) was invited to participate in the exhibition, sharing the stage with well-known brands from around the world with its multi-scenario, multi-category intelligent sensor product matrix, and brought several new products for the audience to display on site.

CIOE has now become a comprehensive exhibition with great scale and influence worldwide. This three-day event aims at hotspots in the industry and market demands, providing new technologies and models for the optoelectronic industry and downstream applications, inspiring new ideas.

For example, the recently released bionic quadruped robot “Xiaomi CyberDog 2” by Xiaomi, which was independently developed by EAI Technology, will showcase its main radar TG30, which provides navigation, obstacle avoidance, and path planning at the event.

In addition, the industrial-grade domestic substitution new product TIA recently released by EAI Technology was also displayed at the event, attracting much attention.

In the future, EAI Technology will continue to be market-oriented, maintain full-stack technology and process self-research, fully leverage its core technology advantages, supply chain integration advantages, and lean intelligent manufacturing advantages of high-quality and high-stability annual production capacity of 6 million units accumulated in consumer-grade and commercial-grade fields. It will be applied to more robot+ scenarios in industries, agriculture, etc., and constantly maintain the rapid iteration and upgrade of products. On the basis of extreme cost performance, it will innovate towards integration and chip integration, while exploring the possibilities of more scenarios, laying a solid foundation for the high-speed evolution, cost optimization and performance improvement of customer products.